I-HPC——Umshini Wokumboza Okungaphakathi Kwangaphakathi

ukulwa nokugqwala kanye nokuthambisa

Ezisetshenziswa ezimbonini, amapayipi asetshenziswa kabanzi ekuthuthweni kukawoyela, igesi yemvelo, amakhemikhali, amagesi, amanzi okuphuza kanye nendle. Kodwa-ke, ukugqwala nokuguguleka okubangelwa yimithombo yangaphakathi kungaholela ekwahlulekeni kwamapayipi, okubangela ukulahlekelwa okukhulu kwezomnotho kanye nezingozi zokuphepha.

Imishini yokumboza i-HPC isebenzisa ipayipi ngokwayo njengegumbi lokufaka. Ngokuhlanganisa ukukhishwa kwe-cathode engenalutho ne-Plasma-Enhanced Chemical Vapor Deposition (PECVD), ifaka ngempumelelo i-Diamond-Like Carbon (DLC) coatings ezindongeni zangaphakathi zamapayipi. Le ndlela igwema ukungcola okuvela ezinhlayiyeni ezinkulu futhi ivumela ukwakheka kwe-coat okusheshayo, okulula, nokufanayo.

Izembozo ze-DLC zibushelelezi, ziminyene, futhi zihlala isikhathi eside, zinobukhulu obusukela ku-2 kuya ku-30μm, ubulukhuni obuncane be-5–10GPa, kanye nesilinganiso sokufakwa kwe-≥0.5μm/min. Le nqubo isebenzisa i-voltage ephezulu ukwenza amagesi aqukethe ikhabhoni abe yi-ion, ikhiqize izinhlayiya ezishajayo eziqhubeka zishayisana futhi zenze ama-molecule egesi abe yi-ion ngaphansi kwensimu kagesi enamandla, okwandisa ukuminyana kwe-plasma futhi kukhuthaze ukukhula kwefilimu ye-DLC.

Ukuze kuhlanganiswe amapayipi, iziphetho zepayipi elingenalutho ziyavalwa ukuze kwakheke isekethe ye-plasma. I-voltage ephezulu ivusa igesi, ithuthukise i-ionization ngaphakathi kwepayipi elide esebenza njengegumbi le-vacuum, ivumela ukufakwa kwe-DLC okufanayo ebusweni bodonga olungaphakathi.

Lobu buchwepheshe buvikela ngempumelelo amapayipi ekugqwaleni, ekuqhekekeni, nasekukhathaleni, kwandisa kakhulu isikhathi senkonzo futhi kuthuthukise ukuphepha ezimbonini zokwelashwa kukawoyela negesi, amakhemikhali, kanye namanzi.